Competition teams whose research outlines have been shortlisted to enter the second stage of the competition are required submit a research report (in English) by 31 August 2022 to email@example.com. For file over 5MB, please instead send a download link to the above email address.
To facilitate your preparation of the research report, a research report sample is provided for reference.
In 2008, Professor Shing-Tung Yau initiated the S.T. Yau High School Science Award (YHSA) in Mainland China. The Award has been running successfully for more than 10 years.
Six subject categories: Mathematics, Physics, Biology, Chemistry, Computer Science and Economic and Financial Modeling. Each group has up to 1 Gold Prize, 1 Silver Prize and 3 Honourable Mentions.
All current secondary school students in Hong Kong and the Asian region outside Mainland China are eligible to join the competition.
Board and committees that provide stringent scientific oversight and management for the Award and their membership.
Let science realise your dream with its imaginative and innovative power by joining the competition.
Deadlines for registration, submissions of research outline and final report, as well as other key dates at a glance.
Selection criteria and assessment process of the competition.
General regulations on academic honesty, concurrent submission, intellectual property, conflict of interest , data collection, etc.
Answers to the most frequently asked questions about the Award and contact information for enquiries.
Result announcement of YHSA(Asia)
Result announcement of YHSA Finale at Tsinghua University, Beijing
Snapshots of oral defenses
2022-2023 YHSA(Asia) has received support from the Innovation and Technology Fund. Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region, the Innovation and Technology Commission or the General Support Programme Vetting Committee of the Innovation and Technology Fund.